SiliconSystems SiliconDrive Blade Wins 2008

SiliconSystems Innovative Small Form Factor SSD Singled Out by Editors

ALISO VIEJO, Calif., January 13, 2009 – SiliconSystems, Inc., a world leader in advanced storage technology, today announced that its SiliconDrive Blade has been selected as a “2008 Best Electronic Design” technology of the year winner in the embedded small form factor category. The Best Electronic Design awards are chosen by the editorial staff of Electronic Design magazine from announcements they have received during the year. Editor Bill Wong cited SiliconDrive Blade’s innovative design as a necessary development in accelerating wide-spread adoption of solid-state drives (SSDs) in embedded systems.

“It is a testament to SiliconSystems engineering expertise to once again be recognized for an industry-changing technology development,” said Michael Hajeck, CEO at SiliconSystems. “Working closely with our customers, SiliconSystems realized a distinct market need for a smaller, more rugged SSD form factor that could accommodate a broad range of storage interfaces, which spearheaded the SiliconDrive Blade development. We are thrilled the editors of Electronic Design have chosen to recognize the innovative and market-enabling qualities of our SiliconDrive Blade products.”

SiliconSystems invented the SiliconDrive Blade product families to provide greater design flexibility to OEMs seeking to use USB, SD, MMC or Serial ATA (SATA) interfaces, which were originally designed for consumer applications, in rigorous Enterprise System OEM applications. SiliconSystems collaborated with Samtec, a worldwide manufacturer of PC board-level interconnects, to develop the SiliconBlade Socket, a robust locking interconnect that securely latches SiliconDrive Blade to a PCB board, and the Small Form Factor Special Interest Group (SFF-SIG), to create an industry standard SiliconDrive Blade specification.

SiliconDrive Blade is based upon SiliconSystems next-generation storage platform that offers faster read/write speeds and enhanced performance and reliability to address critical OEM design considerations such as SSD endurance, elimination of drive corruption and the ability to forecast SSD useable life.

SiliconDrive USB Blade products are shipping now in capacities up to 4 gigabytes (GB). SiliconDrive Blade products featuring the SD, MMC and SATA interfaces will be available for volume shipment in the first half of 2009.

About SiliconSystems
SiliconSystems is a world leader in advanced storage technology engineered exclusively for the high performance, high reliability, multi-year product lifecycle requirements of the Enterprise System OEM market. The company’s patented SiliconDrive, SiliconDrive II, SiliconDrive Blade and SiliconDrive EP technology exceeds the rigorous demands of applications in the netcom, industrial, embedded computing, data center, military and medical markets. SiliconSystems is based in Aliso Viejo, California. Additional company and product information is available on the company’s website at www.siliconsystems.com.

SiliconSystems®, SiliconDrive®, SiliconDrive II®, SiliconDrive II Blade®, SiliconDrive EP®, PowerArmor®, SiSMART®, SiSecure® and the SiliconSystems logo are trademarks or registered trademarks of SiliconSystems, Inc. and may be used publicly only with the permission of SiliconSystems and require proper acknowledgement. Other listed names and brands are trademarks or registered trademarks of their respective owners.

Agency Contact:
Annette Keller
Keller Communication
(949) 640-4811
akeller@siliconsystems.com

SiliconSystems Contact:
Tim Leary
SiliconSystems, Inc.
(949) 900-9402
tleary@siliconsystems.com

Silicon Image Introduces 225 MHz HDMI v1.3 PHY IC and Soft Link IP Core for Consumer Electronics Applications

SUNNYVALE, Calif., December 12, 2008 – Silicon Image, Inc. (NASDAQ: SIMG), a leader in semiconductors and intellectual property for the secure distribution, presentation and storage of high-definition content, today announced its 225 MHz HDMI™ version 1.3 PHY solution, consisting of the SiI9204 HDMI v1.3 transmitter PHY semiconductor and companion HDMI v1.3 link layer intellectual property (IP) core for use in consumer electronics and high-end mobile device applications. This latest offering complements the Silicon Image family of HDMI v1.3 transmitters which include stand-alone discrete semiconductors, PHY semiconductors for use with link layer IP cores and full HDMI v1.3 link and PHY IP cores.

Today, integrated circuit (IC) providers have the option of either using external discrete HDMI chips or fully integrating HDMI functionality into their consumer electronics ICs. Silicon Image now offers an HDMI v1.3 transmitter solution that provides the benefits of both approaches, with a lower bill-of-materials (BOM) cost compared to discrete IC implementations and faster time-to-market compared to a fully integrated system-on-a-chip (SoC) solution. In addition, Silicon Image’s HDMI v1.3 transmitter technology is a silicon-proven, high-volume solution that has shipped in more than 10 million HDMI v1.3 transmitter chips since 2007.

“HDMI version 1.3 is already the standard for digital TVs and is now becoming prevalent in high-definition digital set-top-box and Blu-ray Disc™ player implementations,” stated Ron Richter, director of business development at Silicon Image, Inc. “Silicon Image’s PHY IC and link IP core solution delivers the high-quality video and audio capabilities of HDMI v1.3 without the engineering challenges associated with an SoC analog integration.”

Key features of Silicon Image’s SiI9204 transmitter PHY include:

225 MHz HDMI v1.3 support for Deep Color applications

SiI9002 compatibility mode (for those who use SiI9002 today)

Low power at high resolutions & frame rates (<90mW @ 1080p/60fps 12 bits/pixel)

Low power down current (<10µA)

Integrated CEC hardware support

Display Data Channel (DDC) support

Can support High Bit-Rate audio and x.v.Color with full featured SoCs

40-pin 6X6mm QFN package

Competitive pricing for link IP core licensing and SiI9204 chip

The SiI9204 IC, with built-in Consumer Electronics Control (CEC), is ideal for consumer applications such as digital set-top-boxes, personal video recorders, Blu-ray Disc players, game consoles, high-definition (HD) camcorders and high-end mobile devices. The link layer IP core, designed to be integrated into an SoC, can be quickly targeted to any foundry or process, delivering a key time-to-market advantage when compared to a fully integrated mixed-signal solution.

Planned availability for the SiI9204 transmitter PHY is Q1 2009 and the accompanying link layer IP will be available for integration in Q4 2008. More information on the Silicon Image transmitter IC and IP core solutions can be found at www.siliconimage.com. Companies, engineers and developers interested in additional information should contact Ron Richter at Tel: 1-408-962-4259 or via email at ron.richter@siliconimage.com.

 

About Silicon Image, Inc.
Silicon Image, Inc. is a leading provider of semiconductor and intellectual property products for the secure distribution, presentation and storage of high-definition content. With a rich history of technology innovation that includes creating industry standards such as DVI and HDMI, the company’s solutions facilitate the use of digital content amongst consumer electronics, personal computer (PC) and storage devices, with the goal to securely deliver digital content anytime, anywhere and on any device. Founded in 1995, the company is headquartered in Sunnyvale, California, with regional engineering and sales offices in China, Germany, Japan, Korea, Taiwan and the United Kingdom. For more information, please visit www.siliconimage.com.Forward-looking Statements
This news release contains forward-looking statements within the meaning of federal securities laws and regulations, including, but not limited to, statements regarding the anticipated performance, cost and time-to-market benefits of Silicon Image’s HDMI v1.3 PHY and IP core solution. These forward-looking statements involve risks and uncertainties, including those described from time to time in Silicon Image’s filings with the Securities and Exchange Commission (SEC), that could cause the actual results to differ materially from those anticipated by these forward-looking statements. Silicon Image assumes no obligation to update any forward-looking statement.

Silicon Image and the Silicon Image logo are trademarks, registered trademarks or service marks of Silicon Image, Inc. in the United States and/or other countries. HDMI is a trademark or registered trademark of HDMI Licensing, LLC in the United States and/or other countries. All other trademarks and registered trademarks are the property of their respective owners in the Unites States and/or other countries.

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Media Contacts:
Gabriele Collier
Silicon Image, Inc.
P: 408-616-4088
gcollier@siliconimage.com

Ian Yellin
Ogilvy Public Relations
P: 415-677-2714
ian.yellin@ogilvypr.com

Silicon Image And Scalado Collaborate To Offer Accelerated High-Resolution Photo Rendering On Mobile Phones

SUNNYVALE, Calif., and Lund, Sweden, December 12, 2008 – Silicon Image, Inc. (NASDAQ: SIMG), a leader in semiconductors and intellectual property for the secure distribution, presentation and storage of high-definition content, and Scalado AB, a leader in mobile imaging software solutions for camera phones, today announced that the companies have signed an agreement to integrate Scalado SpeedTags™ technology into the Silicon Image mobile phone camera processor IP (intellectual property) core product line. SpeedTags technology features a modified hardware JPEG encoder that allows high-resolution images to be processed and displayed more quickly than standard JPEG images, the popular format used for compressing still images.

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IDT Updates Projections for Fiscal Third Quarter 2009

SAN JOSE, Calif., Dec. 8, 2008

The Company currently anticipates revenue for the fiscal third quarter of 2009 to be between $165 million and $170 million, down 15 to 18 percent sequentially. Based on the revised revenue outlook, third quarter non-GAAP earnings per share (EPS) is now projected to be approximately $0.14 to $0.15. Prior projections for the fiscal third quarter of 2009 were for revenue to be in the range of $175 million to $185 million and non-GAAP EPS to be between $0.19 and $0.21. Any estimate in the current economic environment has a high degree of risk and visibility into customer end demand continues to be very limited. As such, current estimates could differ materially from actual results.

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NAND Evolution and its Effects on Solid-State Drive (SSD)

ALISO VIEJO, Calif., December 10, 2008 - Below is a link to an excellent new white paper by Gary Drossel, Vice President of Product Planning at SiliconSystems. “NAND Evolution and its Effects on Solid-State Drive (SSD) Useable Life” answers one of the biggest questions in the industry today, “How long will this SSD last?”

The white paper discusses the latest trends in NAND flash-based SSDs, the resulting effects on endurance, and new tools from SiliconSystems to accurately forecast SSD life.

http://semiconductorstoreblog.com/2008/12/544/wp-001-00r/